Lead Frame
1. Anti Epoxy Bleed-Out
Usage | Name | Characteristic |
---|---|---|
Anti bleed-out of Epoxy resin for IC lead-frame, PWB, LED | LB-1 |
|
2. Degreser
Usage | Name | Characteristic |
---|---|---|
Electrolytical ultrasonic degreaser for metal & non-metal | Top Cleaner |
|
3. Ag Stripper
Usage | Name | Characteristic |
---|---|---|
Silver Stripper Agent(None Succinimide Type) | AGS 200 |
|
4. Anti Ag-Cu Cementation
Usage | Name | Characteristic |
---|---|---|
Anti cementation for high speed Ag plating on Cu in IC, LSI, Lead Frame. | Predip S-1 |
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